Omni-Path User Group
We have started an Omni-Path User Group (OPUG) to engage the community using the Intel® Omni-Path Architecture. The group will share experiences and insights using this technology.
To join OPUG, submit the OPUG Registration form.
BoF Session at SC17
The 2nd annual meeting of the Omni-Path User Group was held at a Birds-of-a-Feather (BoF) session at SC17 on Tuesday, November 14, 2017. Session leaders were J Ray Scott, Senior Director of Facilities Technology at PSC and Philip Murphy, architect within the DCG Connectivity Group at Intel Corporation.
The BoF consisted of an introduction, an OPA update from Philip Murphy, brief panel presentations from OPA site representatives, and a group discussion.
The panelists and their talks:
- J Ray Scott, Site/machine: PSC: Bridges
- Results from TSUBAME3.0: a 47 AI-PFlops System for HPC & AI Convergence
- Professor Satoshi Matsuoka, Site/machine: Tokyo Institute of Technology: TSUBAME3.0
- MareNostrum 4
- Sergi Girona, Barcelona Supercomputing Center: MareNostrum
- Stampede 2
- Dan Stanzione, TACC: Stampede 2
- RMACC Summit
- Jonathon Anderson, University of Colorado, Boulder: RMACC Summit
Intel® Omni-Path Architecture (Intel® OPA), an element of Intel® Scalable System Framework, delivers the performance for tomorrow’s high performance computing (HPC) workloads and the ability to scale to tens of thousands of nodes—and eventually more—at a price competitive with today’s fabrics. The Intel OPA 100 Series product line is an end-to-end solution of PCIe* adapters, silicon, switches, cables, and management software. As the successor to Intel® True Scale Fabric, this optimized HPC fabric is built upon a combination of enhanced IP and Intel® technology.