Omni-Path User Group
We are starting an Omni-Path User Group (OPUG) to engage the community using the Intel® Omni-Path Architecture. The group will share experiences and insights using this technology.
To join OPUG, submit the OPUG Registration form.
Kick-off Meeting at SC16
The kick-off meeting of the Omni-Path User Group will be at a Birds-of-a-Feather (BoF) session at SC16. The BoF will be held on Thursday, November 17, 2016 in room 155-A. Please check the SC16 Conference Program for possible changes. The BoF will consist of an introduction, an OPA update from Philip Murphy (Intel), brief panel presentations from OPA site representatives, and group discussion.
The following sites have confirmed that they will present on the panel:
- Panelist TBA, Cineca: Marconi
- Nick Nystrom, PSC: Bridges
- Tommy Minyard, TACC: Stampede 2
- Panelist TBA, University of Colorado, Boulder: 400-node OPA-connected cluster
- Kim F. Wong, University of Pittsburgh Center for Simulation and Modeling
Additional panelists will be announced here soon.
Also at SC16 will be an Intel User Community Social Event, to be held on Tuesday, November 15, from 4:30-6:30pm in the Intel booth (#1819). Click here to register.
Periodic Remote Meetings
We expect subsequent OPUG meetings to be held quarterly by remote teleconference, timed to optimize convenience for participants. The schedule may be adjusted if most participants prefer something else.
Intel® Omni-Path Architecture (Intel® OPA), an element of Intel® Scalable System Framework, delivers the performance for tomorrow’s high performance computing (HPC) workloads and the ability to scale to tens of thousands of nodes—and eventually more—at a price competitive with today’s fabrics. The Intel OPA 100 Series product line is an end-to-end solution of PCIe* adapters, silicon, switches, cables, and management software. As the successor to Intel® True Scale Fabric, this optimized HPC fabric is built upon a combination of enhanced IP and Intel® technology.